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HSB03-141406-Same Sky (Formerly CUI Devices)-HEAT SINK, BGA, 14 X 14 X 6 MM — image 1
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Same Sky (Formerly CUI Devices)

HSB03-141406-Same Sky (Formerly CUI Devices)-HEAT SINK, BGA, 14 X 14 X 6 MM

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Solid Metal Heat Sink for everyday users

The HSB03-141406-Same Sky (Formerly CUI Devices)-HEAT SINK, BGA, 14 X 14 X 6 MM by Same Sky (Formerly CUI Devices) is a value-for-money solid metal heat sink designed for everyday users. It features Manufacturer: Same Sky (Formerly CUI Devices) and Case/Package: BGA.

₹621
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Free Delivery on this order. No minimum order value.

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Total: ₹621
Buying tip: A smart budget buy — solid performance without breaking the bank.
Estimated delivery: 24 Aug7 Sept
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Pan India delivery
15-Day Returns
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Pay with UPI & get 5% cashback (up to ₹50) via Razorpay

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Available on select bank cards at checkout. 0% interest for 3 months.

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Quick Specs

Manufacturer: Same Sky (Formerly CUI Devices)
Case/Package: BGA
Shape: Square, Pin Fins
Length (mm): 14.00
Width (mm): 14.00
Fin Height(mm): 6.00

Ideal For

Everyday convenience
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SKU: robu-2791836Category: Solid Metal Heat Sink

About This Product

The HSB03-141406-Same Sky (Formerly CUI Devices)-HEAT SINK, BGA, 14 X 14 X 6 MM by Same Sky (Formerly CUI Devices) is a value-for-money solid metal heat sink designed for everyday users. It delivers reliable performance at an accessible price.

Key Specifications

  • Manufacturer: Same Sky (Formerly CUI Devices)
  • Case/Package: BGA
  • Shape: Square, Pin Fins
  • Length (mm): 14.00
  • Width (mm): 14.00
  • Fin Height(mm): 6.00
  • Material: Aluminum Alloy — built to last with a quality finish
  • Shipping Weight: 0.001 kg

Why Buy from Elecvora?

Elecvora sources this product directly, cutting out multiple middlemen. Every order includes free shipping, a 15-day return policy, and secure payment via Razorpay.

HSB03-141406-Same Sky (Formerly CUI Devices)-HEAT SINK, BGA, 14 X 14 X 6 MM. Its design ensures improved airflow and effective heat transfer, making it suitable for embedded systems, communication devices, and other compact electronics where efficient and dependable cooling is essential. Images for reference only.

Specifications: 

  1. Type: Top Mount
  2. Package Cooled: BGA
  3. Attachment Method: Adhesive (Not Included)
  4. Shape: Square, Pin Fins
  5. Length: 0.551" (14.00mm)
  6. Width: 0.551" (14.00mm)
  7. Fin Height: 0.236" (6.00mm)
  8. Power Dissipation @ Temperature Rise: 2.1W @ 75°C
  9. Thermal Resistance @ Forced Air Flow: 15.80°C/W @ 200 LFM
  10. Thermal Resistance @ Natural: 35.98°C/W
For more detail refer to the datasheet in Attachments. 

Package Includes:

1 x HSB03-141406-Same Sky (Formerly CUI Devices)-HEAT SINK, BGA,

14 X

14 X 6 MM