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374624B00032G-Boyd Laconia, LLC-HEATSINK BGA 35X35X10MM W/ADH — image 1
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Boyd Laconia

374624B00032G-Boyd Laconia, LLC-HEATSINK BGA 35X35X10MM W/ADH

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Solid Metal Heat Sink for everyday users

The 374624B00032G-Boyd Laconia, LLC-HEATSINK BGA 35X35X10MM W/ADH by Boyd Laconia is a value-for-money solid metal heat sink designed for everyday users. It features Manufacturer: LLC, Boyd Laconia and Case/Package: BGA.

₹1,143
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Free Delivery on this order. No minimum order value.

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Total: ₹1,143
Buying tip: A well-rounded choice at a fair price. Recommended for most buyers.
Estimated delivery: 24 Aug7 Sept
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Quick Specs

Manufacturer: LLC, Boyd Laconia
Case/Package: BGA
Mounting Type: Top Mount
Shape: Square, Pin Fins
Length (mm): 35.00
Width (mm): 35.00

Ideal For

Everyday convenience
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SKU: robu-2791598Category: Solid Metal Heat Sink

About This Product

The 374624B00032G-Boyd Laconia, LLC-HEATSINK BGA 35X35X10MM W/ADH by Boyd Laconia is a value-for-money solid metal heat sink designed for everyday users. It delivers reliable performance at an accessible price.

Key Specifications

  • Manufacturer: LLC, Boyd Laconia
  • Case/Package: BGA
  • Mounting Type: Top Mount
  • Shape: Square, Pin Fins
  • Length (mm): 35.00
  • Width (mm): 35.00
  • Fin Height(mm): 10.00
  • Material: Aluminum — built to last with a quality finish

Why Buy from Elecvora?

Elecvora sources this product directly, cutting out multiple middlemen. Every order includes free shipping, a 15-day return policy, and secure payment via Razorpay.

374624B00032G-Boyd Laconia, LLC-HEATSINK BGA 35X35X10MM W/ADH. Designed to provide reliable cooling for ball grid array devices and other high-density components. Constructed from aluminum, it offers lightweight yet efficient heat dissipation, while the black anodized finish enhances thermal performance and adds surface protection. Its low-profile design makes it ideal for space-constrained applications that demand effective thermal management. Images for reference only.

Specifications: 

  1. Type: Top Mount
  2. Package Cooled: BGA
  3. Attachment Method: Thermal Tape, Adhesive (Included)
  4. Shape: Square, Pin Fins
  5. Length: 1.378" (35.00mm)
  6. Width: 1.378" (35.00mm)
  7. Fin Height: 0.394" (10.00mm)
  8. Power Dissipation @ Temperature Rise: 1.5W @ 40°C
  9. Thermal Resistance @ Forced Air Flow: 7.60°C/W @ 200 LFM
  10. Thermal Resistance @ Natural: 23.40°C/W
For more detail refer to the datasheet in Attachments.

Package Includes:

1 x 374624B00032G-Boyd Laconia, LLC-HEATSINK BGA 35X35X10MM W/ADH