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Thickened Thermal Conductive Silica Gel Pad Size: 10x10x6MM — image 1
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Thickened Thermal Conductive Silica Gel Pad Size: 10x10x6MM

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Multi-Brand Raspberry Pi Cases for everyday users

The Thickened Thermal Conductive Silica Gel Pad Size: 10x10x6MM is a value-for-money multi-brand raspberry pi cases designed for everyday users. It features Item Type: Other Accs. and Product Type: Thermal Insulator Gel pad.

₹544
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Total: ₹544
Buying tip: A smart budget buy — solid performance without breaking the bank.
Estimated delivery: 24 Aug7 Sept
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Quick Specs

Item Type: Other Accs.
Product Type: Thermal Insulator Gel pad
Operating Temperature (°C): -40 ℃ - 200 ℃
Material: Silica Gel
Color: Color of Actual Product Can  vary from given Image
Shipping Weight: 0.002 kg

Ideal For

Everyday carryTravelWork and school
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SKU: robu-1150785Category: Multi-Brand Raspberry Pi Cases

About This Product

The Thickened Thermal Conductive Silica Gel Pad Size: 10x10x6MM is a value-for-money multi-brand raspberry pi cases designed for everyday users. It delivers reliable performance at an accessible price.

Key Specifications

  • Item Type: Other Accs.
  • Product Type: Thermal Insulator Gel pad
  • Operating Temperature (°C): -40 ℃ - 200 ℃
  • Material: Silica Gel — built to last with a quality finish
  • Color: Color of Actual Product Can  vary from given Image — plenty of room for files, apps, and media
  • Shipping Weight: 0.002 kg
  • Shipping Dimensions: 6 × 4 × 1 cm

Why Buy from Elecvora?

Elecvora sources this product directly, cutting out multiple middlemen. Every order includes free shipping, a 15-day return policy, and secure payment via Razorpay.

This is a Thickened Thermal Conductive Silica Gel Pad. The pad is used for good thermal conductivity between IC and heatsink. With the characteristics of softness and elasticity, the thermal pads can cover very incomplete surfaces. Heat can be conducted from the internal device to the metal shell or the heat sink plate Improve the efficiency and service life of heating electronic components. Note:
  1. The actual image may vary in terms of Product dimension
  2. Actual Product Vary form the image 

Feature:

  1. Thermal Conductive Silica Gel Pad
  2. 6.0 W/mK thermal conductivity for fast heat transferring in a short time.
  3. High temperature performance in -40 ℃ - 200 ℃ will not melt.
  4. Contact with any electrical traces wouldn’t result in damage of any sort.
  5. Non-toxic, odorless, anti-corrosion, wear-resistant, anti-static, fire retardant, compression, good insulation.

Package Includes:

1 x Thickened Thermal Conductive Silica Gel Pad

Setup Guide

1
Identify the pins
Locate VCC (power), GND (ground), and data pins (SDA/SCL for I2C, MOSI/MISO for SPI, or TX/RX for UART). Refer to the pinout diagram on the product page.
2
Wire to your microcontroller
Connect VCC to 3.3V or 5V (check the module spec), GND to GND, and data pins to the appropriate GPIO pins on your Arduino or Raspberry Pi.
3
Install libraries
In Arduino IDE, go to Sketch → Include Library → Manage Libraries and search for the sensor library. Install the recommended version.
4
Upload example sketch
Open File → Examples → [library name] → Basic Example. Upload to your board and open Serial Monitor to view output.
5
Calibrate if needed
Some sensors (temperature, humidity, distance) may need a short warm-up period or calibration. Run the calibration sketch if provided.